luckyboomstick

my case has 5 fans, 3 120mm (front, side, back), 2 80mm ceiling and floor of case. front=air in, side=air in, back air=out, ceiling=air in, floor=air out. I have the TT gunmet orb as heatsint (144mm) however it pushes air away from mobo---- my processor on ocassion runs hot, amd6400 x2, I am not over clocking-- I am wondering if my air flow is not sufficient enough to cool. should I have all fans blowing in and leave rear 120mm to blow out? change side fan to blow out to assist heat sink??????? any idea welcome.

imsati

Wow, that's a lot of fans blowing in a lot of directions. The best airflow is actually the simplest: Lower Front Intake, Upper Rear Exhaust. That setup will give the smoothest airflow and 99% of the time, the coolest temps. When you introduce side fans top fans, etc. into the mix, you're creating a lot of turbulence inside the case and increase the chances of 'dead airflow areas' and in turn, warm spots.

Also, I've found that the HSF blowing cool air onto the actual HS yields far better results as far as CPU cooling than those that suck the warm air away.

BTW, how hot is 'hot' in this case? What's your room temp? And have you considered pulling the HSF off and reapplying thermal compound?

Edit: Keep in mind there are some exceptions (having a fan on the case's CPU vent if you have one comes to mind) if you know what you're doing and how to reduce in-case turbulence (cable management and drive placement come to mind), but for the most part, lower cool in/upper warm out is the best.

computeruler

your genna want to change the top fan to air out because hot air rises

luckyboomstick

room temp is usually in the mid 70's to high 70's, 52.c right now, just turned on approx 5 mins ago, and only running ie.... as far as the thermal compound i understand that you don't use much, just enough to cover surface- correct? I used the compound that came with my tt gunmet orb. In going with low cold, high hot, i could reverse directiong on floor to draw air into case (currently it is blowing out) and ceiling fan to blow air out (currently it is drawing air in). keep the side blowing cool air in, and rear blowing out------------------ What about something like liquid cooling??????? don't know it any of that works--------- what do you think?

imsati

Compound that comes with most HSF's usually is random no-name cheap stuff. YUou'd be much better off with a higher-quality compound. No lower / maybe even higher temps after thermal paste

You'll want the smoothest airflow inside the case when all is said and done. A single lower-front intake and single upper rear exhaust will almost always see better flow than a lower front/rear intake and single rear exhaust. Try playing around with a few different setups and see what works best for you. I'd go ahead and reapply the thermal compound first though.

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oscaryu1

Heat rises. "Ceiling" fan should be blowing out. "Floor" fans should be blowing in.

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luckyboomstick

my house is usually mid 70's f. here in fl, however my cpu is usually arround 41c. and rises to 50c. what is a good range ????
reguarding thermal paste,,, what is good brand???? i hear artic silver good????

computeruler

yup artic silver and artic cooling is both good it should lower your temnps by around 10c