As I mentioned before the recommendation is to apply a good sized drop about the size of small pea or you could say blueberry or something in that size range to use as a reference. The label on the AS5 tube clearly advises this along with applying it in a stirring motion to insure being mixed around in case of separation of ingredients. Depending on cpu type you can apply AS5 to either the sink or the cpu to see the same result. Once the compound is spread and firms up it will form a thin wafer bond for transfering heat from the cpu to the HSF.
The one thing tried here was to run the system until the cpu heated up below max to test the overheat protection on the board. But you would want to run it briefly due to the heat factor and then shut it down for a few hours to avoid damaging the cpu. Once the process there has been repeated a few times daily even you will see the temps drop into the normal range. It still takes a few weeks to see the full bonding take place however. The newer line of cpus make life easier by not seeing the chip raised in the center where the thermal compund used can separate leaving the top of the chip exposed. The Socket 939 models are essentially a flat topped square cover where the thermal compound used will spread evenly with greater ease.
|