New computer

PC eye · 07-23-2006, 02:39 AM

Regarding installing a cpu and HSF those go on easy enough. Make you get a tube of Artic Silver 5 and prep the surfaces of the top of the cpu and bottom of sink with some denatured alcohol or very close to insure there is nothing on those surfaces. On a new cpu and HSF you shouldn't see anything to worry about cleaning off.

Once you drop the cpu into the one way insertion socket and bring down the lever you apply a glob about the size of a pea or roughly a 5/16" area sees a large drop. You don't need 1/2 a tube since this will spread evenly across the newer models cpus. The older Socket A and others saw a rise where the compound would kind of separate around it rather then keeping covered at times. The Antec thermal compound tried here recently with a higher temp tolerance would stay to slippery instead of firming up after a few days of use. Once the AS5 went on the same cpu cooler due to the ceramic mix with silver compound things firmed up a little and temps dropped down far lower. The actual gap between hsf and the top of the cpu should be about the thickness of a piece of aluminum foil if that. Monitor the temps for a few days after to make the right amount was applied.

mrjack · 07-23-2006, 05:45 PM

The thing is that AS5 costs 7,90€ which is about 10$ for 3.5grams, plus I have to pay for shipping.

So I would like to get some AS5 but the cost is insane.

EDIT:

Just noticed I might be able to get it for the price of the product itself, no shipping at all. I'll have to contact the shop.

Update:
I won't be able to get a Seagate Barracuda 7200.9 160Gb SATAII harddrive unless I wait until August 7th, so I'll be getting a Western Digital Caviar SE 160Gb SATAII instead.

And what should I use to spread out the AS5? Cause I might be able to find some sort of outdated credit card or something like that but I'm not sure. What else can I use? And where can you usually get some 99% isopropyl alcohol?

PC eye · 07-24-2006, 03:15 AM

The only time you need anything like alcohol would be for removing any remaining compound on a cpu when changing the stock HSF to a 3rd cooler often to get those lower temps or if something does get on either surface. If both are right out of the box you shouldn't need anything but AS5. When applying AS5 you don't want to spread it around like a paint brush with paint but rather put a good sized drop in the center of the sink or cpu and stir it a little in case there is some separation. Once you set the HSF down inplace evenly the compound will spread itself. After you may want to leave everything sitt for a few hours at least for some bonding to take place.

It will still take a few weeks for any compound to set in. But you don't want to rush into running the system immediately to see cpu temps soar. I did that here to test the overheat protection on the new board. But that was under monitored circumstances to power down right away if needed. The OH protection did that fast enough when the initial temp saw 60C! Some will adivise some 4hrs. of wait time and running it for only a few hours on the first day. When it starts bonding well you will see the temps start to drop down to normal. To stir a little when appying the AS5 I simply use the tip of the tube while applying it to save time there. Some non conductive item like a tea or coffee stirrer could work. You won't need a putty knife for this.

mrjack · 07-24-2006, 09:22 AM

Some websites advise to apply a thin layer all over the core or IHS and then put on the HSF while some say you should do it the way you mentioned.

And I've read it's good to have the computer running for a few hours and then turning it off and turning it on after a while. So that the AS5 gets a chance to warm up, cool and then warm up again.

PC eye · 07-24-2006, 08:26 PM

As I mentioned before the recommendation is to apply a good sized drop about the size of small pea or you could say blueberry or something in that size range to use as a reference. The label on the AS5 tube clearly advises this along with applying it in a stirring motion to insure being mixed around in case of separation of ingredients. Depending on cpu type you can apply AS5 to either the sink or the cpu to see the same result. Once the compound is spread and firms up it will form a thin wafer bond for transfering heat from the cpu to the HSF.

The one thing tried here was to run the system until the cpu heated up below max to test the overheat protection on the board. But you would want to run it briefly due to the heat factor and then shut it down for a few hours to avoid damaging the cpu. Once the process there has been repeated a few times daily even you will see the temps drop into the normal range. It still takes a few weeks to see the full bonding take place however. The newer line of cpus make life easier by not seeing the chip raised in the center where the thermal compund used can separate leaving the top of the chip exposed. The Socket 939 models are essentially a flat topped square cover where the thermal compound used will spread evenly with greater ease.

mrjack · 07-25-2006, 10:06 AM

I don't think I'll be getting AS5 just yet, as I the shop that has it charges 6,40€ for the shipping. I'll get it and an aftermarket HSF if I decide I need 'em.

mrjack · 07-25-2006, 02:11 PM

This is so freaking unfair! The 20-pin connector is in the strangest place, behind the 5.25" bay thingy and the +12V connector is on the other end of the motherboard! And now I don't know where to put the PSU because of the connectors that I mentioned before.

Update:

I got it to work outside of the case and I'm probably gonna get a new case as everything is so messy and it's a tight fit to get everything in the current one. Any suggestions on a good case? Doesn't have to be pretty, as long as it's got quite a bit of space and preferrably a place to put a 120mm fan as I already have a 120mm fan. And I'd like a case without a PSU as I already have a PSU and don't want another one.

PC eye · 07-25-2006, 10:48 PM

Quote:

Originally Posted by mrjack

I don't think I'll be getting AS5 just yet, as I the shop that has it charges 6,40€ for the shipping. I'll get it and an aftermarket HSF if I decide I need 'em.

Artic Silver 5 is a top rate thermal compound when compared to others which I have done here on many occasions. You don't have to apply a large amount to have it spread evenly in order to form a good layer between the cpu and sink. It's an easy task there. As far as cases you and I both will be looking for a better case for air flow with 120mm fans. The size of an atx case will still be about the same unless you are somehow running an AT type case there where things are too cramped. You can choose all kinds of cases for less then $50-US these days without a supply. In fact you wouldn't want a supply included unless it's something like an Antec or Enermax case since they usually put some cheap piece of whatever in there. You will still have to shop around at the vendors you order from to get a new one. But I can add a links here to give you some ideas.
http://www.directron.com/case40to49.html
http://www.newegg.com/Product/Produc...&SubCategory=7 (Note: for the price toss the included supply here)
http://www.xoxide.com/allcases.html
http://www.factorydirect.ca/catalog/...t.php?cat=0200
http://www.coolerguys.com/840556028727.html

07-23-2006, 05:45 PM	#12 (permalink)
mrjack VIP Member Join Date: Jul 2005 Location: Finland Age: 18 Posts: 2,590	The thing is that AS5 costs 7,90€ which is about 10$ for 3.5grams, plus I have to pay for shipping. So I would like to get some AS5 but the cost is insane. EDIT: Just noticed I might be able to get it for the price of the product itself, no shipping at all. I'll have to contact the shop. Update: I won't be able to get a Seagate Barracuda 7200.9 160Gb SATAII harddrive unless I wait until August 7th, so I'll be getting a Western Digital Caviar SE 160Gb SATAII instead. And what should I use to spread out the AS5? Cause I might be able to find some sort of outdated credit card or something like that but I'm not sure. What else can I use? And where can you usually get some 99% isopropyl alcohol? __________________ Intel Core 2 Duo E7200 @ 3.45GHz \| MSI P7N Zilent 2x2048Mb OCZ Titanium 800MHz DDR2 Western Digital Caviar 160Gb SATAII Samsung Spinpoint F1 320Gb SATAII Western Digital Caviar 500Gb SATAII Samsung Spinpoint F1 750Gb SATAII MSI NX8800GT OC 512Mb Creative Sound Blaster X-Fi Xtreme Audio Antec Truepower Trio 550W Windows Vista Ultimate 64-bit Last edited by mrjack; 07-23-2006 at 10:40 PM.

07-24-2006, 09:22 AM	#14 (permalink)
mrjack VIP Member Join Date: Jul 2005 Location: Finland Age: 18 Posts: 2,590	Some websites advise to apply a thin layer all over the core or IHS and then put on the HSF while some say you should do it the way you mentioned. And I've read it's good to have the computer running for a few hours and then turning it off and turning it on after a while. So that the AS5 gets a chance to warm up, cool and then warm up again. __________________ Intel Core 2 Duo E7200 @ 3.45GHz \| MSI P7N Zilent 2x2048Mb OCZ Titanium 800MHz DDR2 Western Digital Caviar 160Gb SATAII Samsung Spinpoint F1 320Gb SATAII Western Digital Caviar 500Gb SATAII Samsung Spinpoint F1 750Gb SATAII MSI NX8800GT OC 512Mb Creative Sound Blaster X-Fi Xtreme Audio Antec Truepower Trio 550W Windows Vista Ultimate 64-bit

07-25-2006, 10:06 AM	#16 (permalink)
mrjack VIP Member Join Date: Jul 2005 Location: Finland Age: 18 Posts: 2,590	I don't think I'll be getting AS5 just yet, as I the shop that has it charges 6,40€ for the shipping. I'll get it and an aftermarket HSF if I decide I need 'em. __________________ Intel Core 2 Duo E7200 @ 3.45GHz \| MSI P7N Zilent 2x2048Mb OCZ Titanium 800MHz DDR2 Western Digital Caviar 160Gb SATAII Samsung Spinpoint F1 320Gb SATAII Western Digital Caviar 500Gb SATAII Samsung Spinpoint F1 750Gb SATAII MSI NX8800GT OC 512Mb Creative Sound Blaster X-Fi Xtreme Audio Antec Truepower Trio 550W Windows Vista Ultimate 64-bit

07-25-2006, 02:11 PM	#17 (permalink)
mrjack VIP Member Join Date: Jul 2005 Location: Finland Age: 18 Posts: 2,590	This is so freaking unfair! The 20-pin connector is in the strangest place, behind the 5.25" bay thingy and the +12V connector is on the other end of the motherboard! And now I don't know where to put the PSU because of the connectors that I mentioned before. Update: I got it to work outside of the case and I'm probably gonna get a new case as everything is so messy and it's a tight fit to get everything in the current one. Any suggestions on a good case? Doesn't have to be pretty, as long as it's got quite a bit of space and preferrably a place to put a 120mm fan as I already have a 120mm fan. And I'd like a case without a PSU as I already have a PSU and don't want another one. __________________ Intel Core 2 Duo E7200 @ 3.45GHz \| MSI P7N Zilent 2x2048Mb OCZ Titanium 800MHz DDR2 Western Digital Caviar 160Gb SATAII Samsung Spinpoint F1 320Gb SATAII Western Digital Caviar 500Gb SATAII Samsung Spinpoint F1 750Gb SATAII MSI NX8800GT OC 512Mb Creative Sound Blaster X-Fi Xtreme Audio Antec Truepower Trio 550W Windows Vista Ultimate 64-bit Last edited by mrjack; 07-25-2006 at 04:57 PM.

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07-23-2006, 02:39 AM	#11 (permalink)
PC eye banned Join Date: Apr 2006 Posts: 21,092	Regarding installing a cpu and HSF those go on easy enough. Make you get a tube of Artic Silver 5 and prep the surfaces of the top of the cpu and bottom of sink with some denatured alcohol or very close to insure there is nothing on those surfaces. On a new cpu and HSF you shouldn't see anything to worry about cleaning off. Once you drop the cpu into the one way insertion socket and bring down the lever you apply a glob about the size of a pea or roughly a 5/16" area sees a large drop. You don't need 1/2 a tube since this will spread evenly across the newer models cpus. The older Socket A and others saw a rise where the compound would kind of separate around it rather then keeping covered at times. The Antec thermal compound tried here recently with a higher temp tolerance would stay to slippery instead of firming up after a few days of use. Once the AS5 went on the same cpu cooler due to the ceramic mix with silver compound things firmed up a little and temps dropped down far lower. The actual gap between hsf and the top of the cpu should be about the thickness of a piece of aluminum foil if that. Monitor the temps for a few days after to make the right amount was applied.

07-24-2006, 03:15 AM	#13 (permalink)
PC eye banned Join Date: Apr 2006 Posts: 21,092	The only time you need anything like alcohol would be for removing any remaining compound on a cpu when changing the stock HSF to a 3rd cooler often to get those lower temps or if something does get on either surface. If both are right out of the box you shouldn't need anything but AS5. When applying AS5 you don't want to spread it around like a paint brush with paint but rather put a good sized drop in the center of the sink or cpu and stir it a little in case there is some separation. Once you set the HSF down inplace evenly the compound will spread itself. After you may want to leave everything sitt for a few hours at least for some bonding to take place. It will still take a few weeks for any compound to set in. But you don't want to rush into running the system immediately to see cpu temps soar. I did that here to test the overheat protection on the new board. But that was under monitored circumstances to power down right away if needed. The OH protection did that fast enough when the initial temp saw 60C! Some will adivise some 4hrs. of wait time and running it for only a few hours on the first day. When it starts bonding well you will see the temps start to drop down to normal. To stir a little when appying the AS5 I simply use the tip of the tube while applying it to save time there. Some non conductive item like a tea or coffee stirrer could work. You won't need a putty knife for this.

07-24-2006, 08:26 PM	#15 (permalink)
PC eye banned Join Date: Apr 2006 Posts: 21,092	As I mentioned before the recommendation is to apply a good sized drop about the size of small pea or you could say blueberry or something in that size range to use as a reference. The label on the AS5 tube clearly advises this along with applying it in a stirring motion to insure being mixed around in case of separation of ingredients. Depending on cpu type you can apply AS5 to either the sink or the cpu to see the same result. Once the compound is spread and firms up it will form a thin wafer bond for transfering heat from the cpu to the HSF. The one thing tried here was to run the system until the cpu heated up below max to test the overheat protection on the board. But you would want to run it briefly due to the heat factor and then shut it down for a few hours to avoid damaging the cpu. Once the process there has been repeated a few times daily even you will see the temps drop into the normal range. It still takes a few weeks to see the full bonding take place however. The newer line of cpus make life easier by not seeing the chip raised in the center where the thermal compund used can separate leaving the top of the chip exposed. The Socket 939 models are essentially a flat topped square cover where the thermal compound used will spread evenly with greater ease.

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