a little scared about heat

APM98

New Member
I have a AMD 3800+ AM2, its about 50C at idle and pretty much during a load but when i game it gets up into the 60's. is that really high?
 
its a little warm, within tolerance but a little warmer than it could be, do you have stock cooling on the chip?

how long have the temps been this high and whats the ambient room temperature like? Also where is the base unit located?
 
my room is pretty warm, i just finish the build today. Should I install the AMD cool and quiet driver?

and yes i have the stock coller
 
cool and quiet wont really make that much difference, guessing you went with the stock thermal paste too, i would check to ensure its seated correctly, just make sure contact is made well between cpu and HSF. What fans are running in that case?
 
Thats fairly high for that chip. I would make sure the thermal paste was on and if you used a different paste, make sure you didnt use too much. Also make sure the heatsink is properly attached.
 
hehe I hit just about 80 degrees in both cores in my macbook last night, thats the only bad thing about them. However yes 50 idle and 60 under load is pushing the limits of where your cpu should be running at. If possible replace the thermal paste, AS5 works nicely, and replace your stock cooler if you can. And like what was said before check the airflow in your case, because if that air is not moving properly then the heat just hangs around the heatsink and then the heatsink can't dissipate the heat as effectively as it should be.
 
I did use As5, should i redo it. I did have some trouble putting on the heatsink but then I got it. Should I reapply, if so how should I get rid of the old?
 
remove old thermal paste with rubbing alcohol and a lint free cloth, make sure its totally clean before reapplying
 
dont put it in your mouth lol.

i hate to hijack a thread but i have a q about my thermal stuff. its this nasty dark gray stuff that looks like cement. its hard. is that thermal paste or pad or what. how do i get rid of it?
 
The nasty gray stuff sounds like arctic silver.

A little word on thermal paste.

Too many people are convinced that thermal paste increases thermal transference better than the original CPU heat spreader and heat sink contact metal to metal surface does, but this isn't true. As a result some people apply way too much of the stuff and actually end up making things run hotter. If one were to magnify the apparently smooth surfaces of the CPU heat spreader and the contact surface of the heat sink it would no longer look smooth. It would look rough and porous and anything but smooth and polished. When those two surfaces come together those jagged porous areas don't make contact and as a result they are filled with pockets of air. Air makes a very effective insulator.

Those of you who live in cold northern climates and wear goose down jackets are being warmed by the effectiveness of air insulation. Air insulation is therefore a good thing if one needs to retain heat but a processor can do without any unwanted insulation and thus comes the purpose of thermal compounds. Thermal compounds although not as effective as metal to metal heat transference it is far more effective in heat transference than is air. arctic silver 5 is one of the more effective thermal compounds available because of its ability to transfer heat better than some of the cheaper compounds that look like skin cream.

The key to getting maximum benefit from a thermal compound is to use only as much as is need to eliminate those tiny insulating air pockets. Before applying a thermal compound I remove any previously applied heat pads that are often found on stock heat sinks using a plastic credit card or something similar. Do not use metal to remove the thermal pad because it can scratch the surface and create even more air pockets. The thermal pads are better than having nothing but it is still better if one applies their own thermal compound. Once the pad is removed, clean both the surface of the CPU heat spreader and heat sink contact points with some paper towel and isopropyl alcohol.

Now while taking care not to touch the cleaned surfaces apply a small amount of thermal compound to the center of your CPU and then using the clean plastic card, spread a relatively even but thin layer across its surface. The layer should be thin enough to still see metal under it to insure that only the air pockets are being removed while the surface of the CPU heat spreader and heat sink are still making metal to metal contact.

Applying to much thermal compound can increase your heat by several degrees Celsius and applying it properly can decrease it by a few degrees. So if you're systems reporting too much heat it could be because of improperly applied thermal compounds and by correcting that you could improve cooling by as much as 10 degrees Celsius.

Hope that this helps someone.

HLG
 
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