Thermal compound: CPU and Heatsink

[mazerman]

I just have a quick question that needs a good answer...

Is it necessary to put the thermal compound (paste) between your CPU and heatsink?

I put my PC together w/o any...will it effect anything because i didn't?

Also, for future reference how exactly do you apply the thermal compound?

Thanks!

 

[The_Other_One]

Eh... A computer should run fine without it, but probably too hot... There isn't that connection between the HS and the processor die...

On how to apply it, my statagy is to apply just enough to cover the die of the processor. If the writing on it is pretty clear, then enough to cover that should be good. Too much or too little can cause problems...

 

[Cromewell]

If you used the stock heatsink (the one that came with your CPU) it will have some paste or a pad already on it, otherwise you will want some because there will be poor contact and as said it will run warm/really hot

 

[Platino]

Well, the thermal compound paste is needed to compensate those minimal unevenesses (not visible by the human eye) on the processor-die- and heatsink surface.

Without any kind of "connection material" like thermal compound paste or pads I suppose that you are extremly shortening the lifespan of your processor. These tiny spots on the processor-surface, untouched by the heatsink, will sooner or later lead to an early and unexspected CPU-death.

 

[mazerman]

how exactly do you apply the thermal paste?

...just dab it on?

 

[Platino]

Partially. I dab a tiny amount (not much bigger than a pinhead) of TCP on the die, then I take a cotton bud and disperse it on the surface so that I have a very thin layer of TCP on the die.

For processors with a big heatspreader like Athlon 64 I use a bigger amount of TCP but otherwise I do the same.

 

[LittleHoov]

how exactly do you apply the thermal paste?

...just dab it on?

this is the guide i used http://www.arcticsilver.com/arctic_silver_instructions.htm

 

[ripken2004]

definetly get the arctic silver

 

[joelkyr]

then I take a cotton bud and disperse it on the surface so that I have a very thin layer of TCP on the die.

never use cotton bud, it will leave lint, just put a grain size on the middle of the CPU(make sure its all cleaned), slowly put the HS and turn the HS slowly from left to right(just a bit) with a bit of pressure, this way your spreading the AS5 evenly and outward to avoid airpocket.

 

[Platino]

Of course you shouldn't take a cotton bud that is extremely linty.

Never had any problems with "normal" cotton buds but your argument is comprehensible because a colleague at work says always the same thing when I use the buds.