My Mobo Selections: Any Suggetions?

As far as the main differences between the Home Premium and Ultimate versions of Vista there are things added there. Three additional features are directed towards networking with one hardware problem detection feature added to that. $400 retial-$199.99 OEM for the Ultimate version $269.95 retail-$119.99 seen for the OEM release of the Home Premium edition.

Favoring NVidia chipsets over Intel the Asus model seen at the link here offers what only one other board on that page does namely Quad core support. http://www.newegg.com/Product/Product.aspx?Item=N82E16813131142

Gigabyte and MSI are both close runners while the Gigabyte model seen at the link here also supports Quad core models. http://www.newegg.com/Product/Product.aspx?Item=N82E16813128012

Currently the dual boot with XP and Vista despite initial lack of nothing but Creative's beta drivers for sound was the initial stumbling block along with not seeing Vista patches for older softwares. I still have to boot into the XP primary to run those until buying newer Vista ready releases. XP still has a few things not seen in Vista like the "add/remove Windows components" option in the add/remove programs section in the Control Panel.

Vista offers the ability to shrink, grow, and even reformat existing partitions with it's own Disk Management tools. But it's still a "new" version with some bugs?
 
Once you have the cpu down in the socket and lower the lever and lock that with the clip you then have to apply a thin layer of thermal paste to the heat sink/fan combo and install that as well. If you bought the cpu OEM you will certainly need to buy either a stock replacement for that model or go for a good 3rd party make and model unless you are planning a cpu cookout?
 
PC eye said:
Once you have the cpu down in the socket and lower the lever and lock that with the clip you then have to apply a thin layer of thermal paste to the heat sink/fan combo and install that as well. If you bought the cpu OEM you will certainly need to buy either a stock replacement for that model or go for a good 3rd party make and model unless you are planning a cpu cookout?
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Thanks, thats what I was thinking of (the paste). I havent bought any parts for my new system yet, hope to soon once i get everything I want listed. I am going to be purchasing this and from here http://www.newegg.com/Product/Product.aspx?Item=N82E16819115003 .... retail version, so that should include the thermal paste?
 
If it does it won't be much! The retail package will have one small tube for the single application. If you goof or need to remove the hsf for some reason you will still have to buy some more. What they include is generally "adequate"? but no where as good as AS5 by a long shot. Eventually I'll have a chance to try out the Liquid Pro here to compare the two.
 
PC eye said:
If it does it won't be much! The retail package will have one small tube for the single application. If you goof or need to remove the hsf for some reason you will still have to buy some more. What they include is generally "adequate"? but no where as good as AS5 by a long shot. Eventually I'll have a chance to try out the Liquid Pro here to compare the two.
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OK... so is this stuff easy to apply? Should I just spend the money for http://www.newegg.com/Product/Product.aspx?Item=N82E16835100401 ?
 
yes it is easy to put on the CPU... take the cap off, and squeeze a lil around the CPU, put the fan on, press it, wipe the excess off, clip on the fan, and the cPu if you havent done so already
 
I haven't used Liquid Pro as of yet but that seems to be somewhat different when used as far as the time needed for that to bond. With AS5 the trick is to apply it in a somewhat swirling motion since the silver portion has a tendency to separate from the adhesive portion. The silver is what tranfers the heat more then the usual paste seen with stock sinks. You don't need a ton of Artic applied there.

For an older Socket A type the chip is exposed and the application is right in the senter. With the newer socket types you now see a heat spreader covering the actual chip where a raisin not "grape" sized amount like some seem to think when mentioning that is applied to the center and spreads out evenly for a thin coat. Wiping excess off? That's from applying more then actually needed there.
 
StrangleHold said:
You put a small amount, about the size of a grain of rice, (not a raisin, way to much). Spread it as thin as you can, a stiff piece of plastic or a credit card works good.
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Just how large do you think a small rasin is? The size of a base ball? You can see the obvious difference in the amount to use between the different cpus here where the older Socket A model has the small chip exposed and the newer model with a heat spreader that covers a larger surface.



 
PC eye said:
Just how large do you think a small rasin is? The size of a base ball? You can see the obvious difference in the amount to use between the different cpus here where the older Socket A model has the small chip exposed and the newer model with a heat spreader that covers a larger surface.



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Pretty much bigger than a grain of rice? And who else is talking about socket A processors (YOU)! It would even be a smaller amount!
 
StrangleHold said:
Pretty much bigger than a grain of rice? And who else is talking about socket A processors (YOU)! It would even be a smaller amount!
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The older Intel's also had exposed chips. Anything prior to a P II was soldered to the board directly. Take a reall good look at the surface area of the newer cpus with heat shields and ask if a grain of rice about no larger then the tip of a BIC pen will cover that amount of surface area? A grain of rice is a small small amount. The amount of AS5 used here is seen below.

 
Why are you showing me this crap, first you say the size of a grain of rice and a raisin is the about the same, then you say its not! I have a box full of them from Pen 1s,K6s,Duron,Athlon,Athlon XP,754,939 and a few AM2s I dont need to look at photos!
This is from your Arctic Silver 5 but I guess there wrong too!

Applying Arctic Silver 5: ​
[FONT=Arial,Arial]Carefully apply Arctic Silver 5 directly to the heatspreader of the CPU. Only apply thermal compound to the top of the actual CPU heatspreader. Understand that we are just putting thermal compound in close proximity to the center of the heatspreader. Only a small amount of Arctic Silver is needed. The example at left shows you an approximate amount to use, about the size of one a half uncooked grains of short-grain white rice or ¾ of a BB. [/FONT]
[FONT=Arial,Arial]http://www.arcticsilver.com/pdf/appinstruct/as5/ins_as5_amd_dual_wcap.pdf[/FONT]

But I guess in a 3 paragraph post you can even turn that around it fit your twisted world.
 
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PC eye said:
Step 2: Apply a small amount of paste to CPU die "For people with heatspreaders, you would need to use more. But start off with as little as you think would give a super thin layer. It's always better to have too little to start (because you can add some more after Step 3 and repeat). http://www.neoseeker.com/Hardware/faqs/kb/5,61.html
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What I tell Ya!! You would turn it around, this is from AC5, no wonder you have a long burn in time, your baking a cake!!
This is for heat spreaders
Applying Arctic Silver 5: ​
[FONT=Arial,Arial]Carefully apply Arctic Silver 5 directly to the heatspreader of the CPU. Only apply thermal compound to the top of the actual CPU heatspreader. Understand that we are just putting thermal compound in close proximity to the center of the heatspreader. Only a small amount of Arctic Silver is needed. The example at left shows you an approximate amount to use, about the size of one a half uncooked grains of short-grain white rice or ¾ of a BB. [/FONT]
 
I didn't turn any around. Burn in time? AS5 is a thermal grease that settiles in about 200hrs. of use as the silver particles shift around when heated. What you are obviously missing is the different methods of application depending on whether you are apply a thermal grease(best actual term) or a ceramic type of adhesive mix that does need time to heat and cool and then heat up again until a certain amount of time has passed. And then there are thermal pads which of course are at the bottom of the stock list there.
 
That didnt have anything to do with what were talking about. My post was this.
(You put a small amount, about the size of a grain of rice, (not a raisin, way to much). Spread it as thin as you can, a stiff piece of plastic or a credit card works good.)


The point here is you use to much! With the amount of thermal grease your using it turns it into a thermal pad! By which makes the burn in time useless! The amount is suppost to be thin enough that it just fills in the imperfections between the heatsink and core or IHS (not a layer between the two)
 
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You won't have to worry about that now since WeatherGeek has already been busy getting answers on other things. The question was already answered.
 
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