^ Nah, you don't spread it out before you put the heatsink on. It makes air bubbles.
Think about it. If you have the typical "rice grain" or "small pea" shaped gob of grease, then it will flatten out uniformly as you push down. If you spread it out, then it'll have ripples in it, and when you put the heat sink on, air will be trapped in the troughs. Where else is it going to go?
As far as thermal compound, for the cost I just use TX-2 or MX-2. Works really well for what it is. You dont grease the system, its just for the CPU. Just put a small rice size amount in the middle of the CPU and let the Heatsink spread it out or spread it out as thin and even as possible, then apply the heatsink.
I gotcha. My question was whether or not I should apply thermal compound (to the CPU) for the system I am building. Is it recommended for all CPUs?
Based on the conversation here it looks like I should.