i've looked up mutliply how to's on putting on thermal compound, just have a question, i have a general idea of how big of a splot to leave on the top of the cpu before i put the heatsink directly down on top, but i was wondering how thick this blot should be? Also i'm useing a brush, so it doesn't really come down in a blot, can anyone help me with how i should apply it. Ps its on an amd athlon x2 3600+, thanks
Thermal compound application
- Thread starter kirby001
- Start date
thealmightyone
New Member
You're using a brush? Are you using Zalman STG-1? If so, just apply all over. The brush will apply the correct thickness of paste.
If this is thick paste, and you're using a brush you found in a drawer, stop. Just apply a drop the size of a BB, in the center, and let the heatsink spread it out. Make sure to swivel the heatsink left and right a bit a few times to ensure no air is trapped (air is a poor heat conductor) before locking it down.
If this is thick paste, and you're using a brush you found in a drawer, stop. Just apply a drop the size of a BB, in the center, and let the heatsink spread it out. Make sure to swivel the heatsink left and right a bit a few times to ensure no air is trapped (air is a poor heat conductor) before locking it down.
If it has a IHS heat spreader I would spread it out before appplying the heatsink. Its a common fact that alot of times it does not spread out all the way on a IHS. If the processor does not have a IHS just putting on the heatsink and letting it spread will work just fine.
Last edited:
thealmightyone
New Member
You've mixed it up.
With an IHS, you only need the center area, directly above the CPU, covered. That is why the recommended method for application is a drop, then clamp heatsink down, as most people have IHS's on their processors.
Without an IHS, you have a naked core. The entirety of that core needs to be cooled, so manual spreading is recommended to get paste to all 4 corners as well as the center.
You can find places that say to do it either way, I spread it out, always have. If you just put it in the middle and put the heatsink on it doesnt spread to the ends of the IHS. Then you end up with a glop over the core and none on the rest of the spreader, then since theres more in the middle the heatsink barely touches the IHS around the edges, causes uneven surface which is what your tryin to not happen, its better to have full contact between the IHS and the heatsink! The compound is there to full in places that have no contact between the heatsink on IHS because of surface flaws on both, not to have a layer between them!
Last edited:
PohTayToez
Active Member
Here is what I've read a learned from experience...
The thermal compound is only meant to fill the tiny gaps between the heatsink and the CPU, not provide a barrier between the two. The more metal to metal contact you can get, the better, meaning the thinner you spread it the better. If you can find something like a credit card (I use an old gift card or whatever I have in my wallet), that's a great spreader.
The thermal compound is only meant to fill the tiny gaps between the heatsink and the CPU, not provide a barrier between the two. The more metal to metal contact you can get, the better, meaning the thinner you spread it the better. If you can find something like a credit card (I use an old gift card or whatever I have in my wallet), that's a great spreader.
Exactly