What Thermal paste should i use (Poll)

Your choice!

  • Total voters
    27
Shane

Shane

Super Moderator
Staff member
Hi all,

i have the Asus Silent Knight II cooler.

Curently i have AS5 applied,i applied it in a line down the middle about the size of a grain of rice around a month ,maybe a bit longer ago.

However im not happy with the temps! im running at 2.7Ghz for now.

temp1.jpg


I have these three thermal paste,which one do you think would get the best results from?

Please vote what i should use for my situation... (I alrady have all 3 of these just dont know which one to use!)

1)Artic silver 5

as5-1.JPG


2)Asus High performance thermal paste (got this with cooler)

tp.jpg


3)MX-2
3_thumb.jpg



Also i see alot of people putting a little line down the middle,and some spread the paste out on their C2D so what should i do?
 
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ive used the zalman paste and AS5 and i prefer the AS5, most people try different ways personaly i put enough on so that it covers the whole heatsink also when your Heatsink is attached giv it some twists so that there isnt any air bubbles left behind.
 
Aziek said:
ive used the zalman paste and AS5 and i prefer the AS5, most people try different ways personaly i put enough on so that it covers the whole heatsink also when your Heatsink is attached giv it some twists so that there isnt any air bubbles left behind.
Click to expand...

what are your temps?
 
i just ordered some MX-2 off newegg. I've been using AS-5 on my 6000 x2 cpu, and my temp have always been hot. I know that the processor usually runs hot for everyone, so i
m not too worried.
 
I know that the processor usually runs hot for everyone
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yeah the 6000 always gets warm

i always put a pea size blob of grease in the middle then spread it with a credit card, so it covers the cpu, apart from near the edges (so when you press the HS to it, it doesnt squidge out) and i always do it so it covers it, but thinly.

I got a Pentium Extreme (overclocked to 4.2) so it is naturally very warm. I used to get about 50 idle and 60 under load , which worried me as the extreme can get fried above about 65/70, so with AS5 and a new HS/Fan i got it down to about 45 idle and 55 under load
 
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MX-2 is the best now, it doesn't have a "burn in" period like AS5. From tests, its about 1-2c cooler, but your not going to see a big difference.

For a C2D, you should apply it like this. It must be in the same direction.
 
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i might apply the MX-2 then this time but instead of just putting down a line i might actualy spread it.
 
I vote the MX-2, I applied it to my heatsink on my old desktop. Temps went down by 4*C when compared to the stock thermal pad on the Core 2 Duo's stock heatsink...
 
http://www.frozencpu.com/products/3...ry_Liquid_PRO_Thermal_Interface_Material.html


its the best for heat conduction.. but on the other hand, it solidifies after 2 days and you can't take the heatsink off after that.

also be very careful because it conducts electricity much better than other compounds. all the warnings are there on frozencpu.. im just repeating lol..

i personally have always used AS5... but for my next build im going to put a couple bucks into that stuff to keep it 3-5C below what AS5 can achieve. worth it for what it costs if you ask me.

edit: destroys aluminum! do not use on aluminum heatsinks!
 
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that makes me think its got some mercury in it, it says that it is not to come in contact with aluminum, mercury actually destroys aluminum, that also looks like an insuline syringe
 
just a noob said:
that makes me think its got some mercury in it, it says that it is not to come in contact with aluminum, mercury actually destroys aluminum, that also looks like an insuline syringe
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yes it shouldn't be used with aluminum heatsinks, i had that in my original post which the server timed out and it didnt get saved.

yea its the professional stuff. i dont think it has mercury in it, but its 9x as good as any other stuff it says.. and tests show that it performs better than others by a few degrees celsius.

its worth it if you know what you're doing.
 
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fade2green514 said:
http://www.frozencpu.com/products/3...ry_Liquid_PRO_Thermal_Interface_Material.html


its the best for heat conduction.. but on the other hand, it solidifies after 2 days and you can't take the heatsink off after that.

also be very careful because it conducts electricity much better than other compounds. all the warnings are there on frozencpu.. im just repeating lol..

i personally have always used AS5... but for my next build im going to put a couple bucks into that stuff to keep it 3-5C below what AS5 can achieve. worth it for what it costs if you ask me.

edit: destroys aluminum! do not use on aluminum heatsinks!
Click to expand...

Thats scary...If you had either a Cpu or Hsf fail after it would set in would you be able to separate them? If you returned the defective item attached to the other would the maker of either the Cpu or heat sink honor the warranty with it attached like that?
 
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