Which paste, i have heard MX1 is better than AS5

The brand that offers more then Artic Silver 5 is called Liquid Pro. That came out about 1 1/2yrs. ago and is supposed to have a higher silver content. That would also explain the higher prices seen on it. $5-7 for AS5 while LP sees some $14+? for the same amount.
 
Liquid Pro is better, but if you remove your heatsink (to upgrade for example), you effectively have to lap to remove it, as it solidifies sometime after application. I had to lap my GPU HS, but I managed to wipe the LP off the core for some reason.

But, only ever use LP with copper. No aluminium.
 
You would at least consider that when having a copper based hsf there then. Does it set in the same amount of time or faster would be one question to ask about it? I'm still using AS5 for the present time now.
 
Personally I use arctic silver because its the one that I got with my system and it worked very well so I have never bothered finding out about other brands.
 
It sounds like AS5 wins out over LP while that is supposed to a better heat conductor. I haven't even used up the one application missing tube of AS5 from last spring when putting this case together. I guess that stays a little more pliable as a paste.
 
LP is a FAR FAR better heat conductor (10x more I think), because it is just metal. So, if you apply it badly, and it leaks out, it WILL fry your CPU.

No idea how long it takes to set. Probably the same as AS5, maybe a bit quicker.

But, after finding out that it solidifies, I won't use it again (still got a syringe of LP, used once).
 
The descriptions on it when first seen pointed out the higher silver content it is supposed to have along with a better adhesive mix. So the advice there is to apply as little as possible in a thin spread to avoid mishaps. With the newer models of course over the older cpus you no longer see the chip exposed but instead covered with a heat spreader. There you would evenly spread the small amount used before lowering the hsf then.
 
AS5 maintains the most silver content, it is a real integra. I have seen a comparison between all of the thermal compounds and AS5 finished first
 
I've had one application of AS5 on the system here and when the case is dust free after a cleaning the temps are down to where they were last year when putting everything into the current one. LP could however work here since the Zalman CNPS 9500 is copper not aluminum. But what would I do with the rest of the AS5 left in the tube? :confused: :P
 
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